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| 05323 CSP040605C CHIP SCALE LOW CAPACITANCE FLIP CHIP TVSARRAY APPLICATIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FLIP CHIP DFN-6 FEATURES ESD Protection > 25 kilovolts Available in 5V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Low Clamping Voltage Bidirectional Configuration & Monolithic Structure Protects 3 to 5 Lines Low Capacitance Low Leakage Current RoHS Compliant MECHANICAL CHARACTERISTICS Molded Chip Scale Package Low Profile - 0.254 mm Maximum Height Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel No Under-Fill Required Prevents Solder Leakage and Solder Shorts PIN CONFIGURATION 05323.R0 11/09 1 www.protekdevices.com CSP040605C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TA TSTG VALUE 200 -55 to 150 -55 to 150 UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE @ 1mA V(BR) VOLTS 6.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 11.0 @ 25C Unless Otherwise Specified MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @8/20s VC @ IPP 13V @ 15A MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 10 TYPICAL CAPACITANCE VWM VOLTS CSP040605C 5.9 @0V, 1 MHz C pF 35 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10000 120 IPP - Peak Pulse Current - % of IPP FIGURE 2 PULSE WAVE FORM tf Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 100 80 60 40 20 0 PPP - Peak Pulse Power - Watts 1000 200W 8/20s Waveform e-t 100 td = t I /2 PP 10 0.1 1 10 100 td - Pulse Duration - s 1000 10000 0 5 10 15 t - Time - s 20 25 30 05323.R0 11/09 2 www.protekdevices.com CSP040605C GRAPHS 100 80 % Of Rated Power FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) 14 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20 05323.R0 11/09 3 www.protekdevices.com CSP040605C APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53C Above Maximum Solder Melt Temp) TP Ramp-Up Solder Melt (Maximum Temp) Temperature - C Flux Activation Temp Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds Ramp-Up 15 seconds (Minimize) Solder-Time 15-20 seconds Ramp-Down 05323.R0 11/09 4 www.protekdevices.com CSP040605C CHIP SCALE PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS DIM F D G A MILLIMETERS MIN MAX 1.47 0.97 0.102 0.230 0.457 0.230 0.457 0.051 0.076 0.177 1.57 1.07 0.152 0.279 0.558 0.279 0.558 0.051 0.101 0.203 INCHES MIN MAX 0.058 0.038 0.004 0.009 0.018 0.009 0.018 0.002 0.003 0.007 0.062 0.042 0.006 0.011 0.022 0.011 0.022 0.002 0.004 0.008 TOP E A B C D E F G H I J TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Dimension "H" is between centers. 3. Suffix-T7 = 7 Inch Reel - 5,000 pieces per 8mm tape, i.e., CSP040605C-T7. C I SIDE H J 05323.R0 11/09 5 www.protekdevices.com |
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